SYNTHETIC CHEMICAL VINA
Expert in glue and dispensing solutions
Expert in glue and dispensing solutions
A thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 1500LVO is a 1.5 W/m-K thermally conductive,ultra-conforming, silicone-based liquid gap filler (2-part). It offers high temperature resistance and is proven to have significantly lower levels of silicone outgassing. BERGQUIST GAP FILLER TGF 1500LVO cures at room temperature or can be accelerated using heat and is ideal for applications that are fragile or do not require a strong bond due to a lower level of adhesion strength. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat.
After cured BERGQUIST GAP FILLER TGF 1500LVO provides a soft, thermally conductive, form-in place elastomer that is ideal for fragile assemblies and filling unique and intricate air voids and gaps.
Key features
| Technology | Silicone |
| Cure | Room temperature cure or Heat cure |
| Appearance (Part A) | Yellow |
| Appearance (Part B) | White |
| Appearance (cured) | Yellow |
| Components | Two components – requires mixing |
| Mix ratio by weight Part A: Part B | 1:1 |
| Mix ratio by volume Part A: Part B | 1:1 |
| Solids Content, % | 100 |
| Operating Temperature Range | -60 to 200ºC |
| Applications | Thermal management, TIM (Thermal Interface Material) |
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