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Typical Use: Used for the encapsulation of various components and modules.
Brand: Hysol
Chemical Composition: Epoxy
Color: Tan
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 36 to 48h @ 25 °C; 3h @ 60 °C
Dielectric Strength: 50 kV/mm
Elongation: 14%
Flash Point: 101.6 °C
Hardness: 75 D
Key Specifications: UL-94, 94HB
Mix Ratio: 100:100 by volume; 100:90 by weight
Specific Gravity: 1.45
Tensile Strength: 2,250 psi
Thermal Conductivity: 0.42 W/mK
Viscosity: Part B: 9,000 @ 25 °C; Mixed: 25,000 @ 25 °C
Volume Resistivity: 2 x 10^13 ohm-cm @ 25 °C; 4 x 10^9 ohm-cm @ 105 °C
Working Time: 135 to 230min @ 25 °C

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