Thermally Conductive Material SilCool™ TIA208R

SilCool TIA208R is a 2-component, thermally conductive material used for potting and gap filling. When cured at room temperature or quickly with heat, it cures to a thermally conductive rubber that adheres well to most metal and plastic substrates without the need for primers. The flowability of SilCool TIA208R allows it to conform to complex 3-dimenstional shapes and cavities, filling voids and thereby creating a thermal path to remove heat.

Key features

• Primerless adhesion to metals and plastics
• Good thermal conductivity
• Ease of use 1:1 mixing ratio
• Quick cure and adhesion with heat or at room temperature
• Flame retardancy: UL94V-0 certified (File No: E56745)
• Continuous operating temperature range of -40 ~ 150°C
• UL RTI rating: 150°C

Applications

• Thermal potting for power supplies
• Drivers in LED light bulbs
• Ballasts and electronic devices