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XE11-B5320 is a one-component paste, alkoxy cure, thermally conductive silicone adhesive sealant. This product cures at room temperature by reacting with moisture in the air to form an elastomeric rubber. XE11-B5320 silicone adhesive typically offers primerless adhesion to many substrates such as most metals, plastics, ceramics, and glass without the use of a primer.
XE11-B5320 silicone adhesive is non-corrosive to metals and may be suitable for electrical/electronic applications. Typical applications for XE11-B5320 silicone adhesive include sealing and bonding for thermally conductive applications such as heat generating elements, regulators and rectifiers.
FEATURES:
Uncured Properties
Appearance | White, paste |
Tack Free Time (23°C) min | 5 |
Cured Properties (7 days @ 23°C/50%RH).
Appearance | White, elastic rubber |
Specific Gravity (23°C) | 2.59 |
Hardness (Type A) | 83 |
Tensile Strength MPa [psi] | 4.1 [595] |
Elongation % | 50 |
Adhesive Strength(1) MPa [psi] | 1.4 [203] |
Thermal Conductivity W/mK [cal/(s•cm•°C)] | 1.3 [3.1 x 10^-3] |
Low Molecular Siloxane (D4~D10) wt % | 0.01 |
Volume Resistivity MO•m [O•cm] | 2.0 x 10^-7 [2.0 x 10^-15] |
Dielectric Strength kV/mm (V/mil) | 17 [431] |
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