SYNTHETIC CHEMICAL VINA
Expert in glue and dispensing solutions
Expert in glue and dispensing solutions
LOCTITE ABLESTIK QMI536NB is a low bleed nonconductive, PTFE-filled paste designed for stacked die applications that require very low stress and robust mechanical properties. The material has the same processing and properties of QMI536 but resin bleed is essentially eliminated.
These features produce fast cure capability and enhanced reliability performance to a wide variety of surfaces, including solder resist, flexible tape, bare silicon, and various die passivations.
A package or device manufactured with this product will have high resistance to delamination and popcorning after multiple exposures to lead-free solder reflow temperatures.
| Cure Type | Heat |
| Appearance | White |
| Viscosity (Brookfield) 25°C, 5 rpm | 10,000 |
| Glass Transition Temperature (Tg) | -30 |
| Modulus @ 25°C | 300 |
| CTE Below Tg | 80 |
| CTE Above Tg | 150 |
| Recommended Cure | 30 min. @ 175°C |
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