SYNTHETIC CHEMICAL VINA
Expert in glue and dispensing solutions
Expert in glue and dispensing solutions
LOCTITE ABLESTIK ATB 120U, Rubberized Epoxy, Die Attach
LOCTITE® ABLESTIK ATB 120U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability.
FEATURES:
| Wafer Backside Lamination | |
Temperature, °C Pressure, psi Taping Duration, ft/ minute | 65 to 70 40 1 |
| Chip Attach | |
Temperature, °C Pressure, kg-f Attach Duration, second | 100 to 120 0.5 to 2 1 to 2 |
| Glass Transition Temperature (Tg) by TMA, °C | 75 |
| Thermal Conductivity , W/(m-K) | 0.21 |
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