SYNTHETIC CHEMICAL VINA
Expert in glue and dispensing solutions
Expert in glue and dispensing solutions
BERGQUIST GAP FILLER TGF 4500CVO is a high thermally conductive liquid gap filler which aims for easy, precision dispensing and low stress assembly. Controlled volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 4500CVO is a 4.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). The silicone-based material offers infinite thickness variation without causing additional stress to components, and the formula ensures optimal viscosity for efficient automated dispensing processes. This product is curable at room temperature. However, the cure rate can also be accelerated with application of heat.
| Cure type | Heat Cure, Room Temperature (Ambient) Cure |
| Operating temperature | -60.0 – 200.0 °C |
| Shelf life, @ 25.0 °C | 180.0 day |
| Thermal conductivity | 4.5 W/mK |
| Technology | 2K Silicone |
| Appearance (Part A) | White |
| Appearance (Part B) | Pink |
| Appearance when cured | Pink |
| Components | Two components – requires mixing |
| Mix ratio by weight Part A: Part B | 1:1 |
| Mix ratio by volume Part A: Part B | 1:1 |
| Key features |
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| Cure | Room temperature or heat cure |
| Operating temperature | -60 to 200ºC |
| Applications | Thermal material, Liquid gap filler such as: Power inverter, EV charger, Surface mount power switching, use between heat generating semiconductor packages and heat sink |
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