SYNTHETIC CHEMICAL VINA
Expert in glue and dispensing solutions
Expert in glue and dispensing solutions
BERGQUIST GAP FILLER TGF 4000 is a high thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Excellent low and high temperature, mechanical and chemical stability.
BERGQUIST® GAP FILLER TGF 4000 is a 4.0 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). The mixed liquid system cures at room temperature or can be accelerated using heat. It offers extended working time for improved manufacturing flexibility and the low-level natural tack characteristics are ideal for assemblies where strong structural bonds are not required.
Key features:
TYPICAL APPLICATIONS
| Technology | Silicone |
| Appearance – Part A | Blue |
| Appearance – Part B | White |
| Appearance – Cured | Blue |
| Cure | Room temperature cure or Heat cure |
| Mix ratio, by volume | 1 : 1 |
| Mix ratio, by weight | 1 : 1 |
| Operating Temperature Range | – 40 to 100ºC |
| Thermal conductivity | 4.0 W/mK |
| UL Flammability Rating | UL 94 V-0 |
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