SYNTHETIC CHEMICAL VINA
Expert in glue and dispensing solutions
Expert in glue and dispensing solutions
BERGQUIST GAP FILLER TGF 3500LVO is a high thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 3500LVO is a 3.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). The ultra-conforming feature combined with its low volatility makes it the ideal solution for use in medical electronics and other fragile or low stress assemblies such as Optics and Automotive in-cabin electronics.
The mixed system provides infinite thickness variations without adding extra stress to components and will cure at room temperature or can be sped up with the addition of heat. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat.
Key features:
TYPICAL APPLICATIONS
| Technology | Silicone free |
| Appearance – Part A | Light Blue |
| Appearance – Part B | White |
| Appearance – Cured | Blue |
| Cure | Room temperature cure or Heat cure |
| Mix ratio, by volume | 1 : 1 |
| Mix ratio, by weight | 1 : 1 |
| Operating Temperature Range | – 40 to 100ºC |
| Thermal conductivity | 3.5 W/mK |
| UL Flammability Rating | UL 94 V-0 |
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