Expert in glue and dispensing solutions
BERGQUIST GAP FILLER TGF 3000SF is a 2-part silicone-free, room temperature curable gap filler designed for use in high throughput assembly applications.
BERGQUIST GAP FILLER TGF 3000SF is a 2-part silicone-free gap filler that is curable at room temperature and is suitable for use in high throughput assembly applications. With a 3.0 W/m-K thermal performance, it provides an excellent solution in the assembly of high-performance power devices.
Key features:
TYPICAL APPLICATIONS
Technology | Silicone free |
Appearance – Part A | Blue |
Appearance – Part B | White |
Appearance – Cured | Blue |
Cure | Room temperature cure or Heat cure |
Mix ratio, by volume | 1 : 1 |
Mix ratio, by weight | 1 : 1 |
Operating Temperature Range | – 40 to 100ºC |
Thermal Conductivity | 3.0 W/m-K |
UL Flammability Rating | UL 94 V-0 |
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