SYNTHETIC CHEMICAL VINA
Expert in glue and dispensing solutions
Expert in glue and dispensing solutions
3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ Wafer Support Systems (WSS) adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
FEATURES
APPLICATIONS
Wafer De-Taping
| Property | Values | Unit | Test Method |
| Tape Thickness | 0.068 | mm | JIS Z 0237 |
| Tensile Strength | 78.4 | N/cm | |
| Elongation | 125 | % | |
| Adhesion Strength | 9.41 | N/cm |
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