3M™ Thermally Conductive Interface Pad 5595

3M™ Thermally Conductive Interface Pad 5595 is  designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices. 

FEATURES

• Provides for good thermal stability of the base polymer with excellent softness of the thermal pad.
• Offers good thermal conductivity in a soft silicone polymer base.
• The product tack is such that a mechanical means to support the pad in a final assembly is required.

APPLICATIONS

• 3M™ Thermally Conductive Interface Thermal Pad 5595 is designed to provide a preferential heat-transfer path between heat-generating and cooling devices (e.g., fans, heat pipes and heat sinks).