SYNTHETIC CHEMICAL VINA
Expert in glue and dispensing solutions
Expert in glue and dispensing solutions
TIA222G thermally conductive silicone is a two-component material used for encapsulating, gap filling, and as a thermal path to heat sinks. The flowability of TIA222G silicone allows it to conform to complex three-dimensional shapes and cavities in potting applications. TIA222G silicone quickly cures to a soft rubber gel with exposure to heat, and will also cure at room temperatures.
FEATURES:
APPLICATIONS:
| Criteria | Unit | Part A | Part B |
| Color | Dark Gray | Light Gray | |
| Mixing Ratio (by weight or volume) | 100:100 | ||
| Viscosity (23 °C) (after mixing) | Pa.s | 20 | |
| Pot Life | h | 20 | |
| Cure Condition (with heat) | °C / h | 70/ 0.5 | |
| Cure Condition (room temperature) | h | 24 | |
| Post-Cure Properties | |||
| Density (23 °C) | g/cm^3 | 2.81 | |
| Thermal Conductivity | W/(m.K) | 2.2 | |
| Hardness (type E) | 45 | ||
| Volume Resistivity | MΩ.m | 4.8×10^6 | |
| Dielectric Strength | 20kV/mm | 20 | |
| CTE | ppm/K | 140 | |
| Low Volatile Siloxane (D3 – D10) | ppm | <200 | |
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