
Expert in glue and dispensing solutions
BERGQUIST GAP FILLER TGF 3000SF is a 2-part silicone-free, room temperature curable gap filler designed for use in high throughput assembly applications.
BERGQUIST GAP FILLER TGF 3000SF is a 2-part silicone-free gap filler that is curable at room temperature and is suitable for use in high throughput assembly applications. With a 3.0 W/m-K thermal performance, it provides an excellent solution in the assembly of high-performance power devices.
Key features:
TYPICAL APPLICATIONS
| Technology | Silicone free |
| Appearance – Part A | Blue |
| Appearance – Part B | White |
| Appearance – Cured | Blue |
| Cure | Room temperature cure or Heat cure |
| Mix ratio, by volume | 1 : 1 |
| Mix ratio, by weight | 1 : 1 |
| Operating Temperature Range | – 40 to 100ºC |
| Thermal Conductivity | 3.0 W/m-K |
| UL Flammability Rating | UL 94 V-0 |
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