SYNTHETIC CHEMICAL VINA
Expert in glue and dispensing solutions
Expert in glue and dispensing solutions
Ultra Light-Weld 9008 engineered for chip encapsulation on flex circuits cures upon exposure to UV and/or visible light and is designed for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board applications. Dymax 9008 encapsulant forms flexible, highly moisture-resistant bonds to diverse surfaces such as polyimide (Kapton®), DAP, glass, epoxy board, metal, and PET. 9008 remains flexible to -40°C, making it ideal for COF applications. It is engineered for chip encapsulation on flex circuits. This product is thixotropic, allowing for easy formation of a protective encapsulant layer. It has a low dielectric constant for high frequency applications. This encapsulating material may be used in attaching FPCs to various substrates including PCB and glass.
FEATURES:
APPLICATIONS:
| Uncured properties | ||
| Property | Value | Test method |
| Solvent content | No Nonreactive solvent | N/A |
| Chemical class | Acrylated urethane | N/A |
| Appearance | transparent Lt. yellow liquid | N/A |
| Soluble in | Organic solvents | N/A |
| Density, g/ml | 1.03 | ASTM D1875 |
| Viscosity, cP (20rpm) | 4,500 (nominal) | ASTM D2556 |
| Cured mechanical properties | ||
| Property | Value | Test method |
| Durometer hardness | D35 | ASTM D2240 |
| Tensile at break, MPa [psi] | 10 [1,500] | ASTM D638 |
| Elongation at break, % | 270 | ASTM D638 |
| Modulus of Elasticity, MPa [psi] | 45 [6,500] | ASTM D638 |
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